Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading
Introduction:
It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achieving the presintering bonding of electric components for high precision heating system.
Features:
- Die bonding ability with high speed and high accuracy
- Placement head and platform with heating function
- Temperature control system with high accuracy
- Accurate force control system
- Wafer loading support
- Automatic nozzle change
- Automatic pin base change
- Compact structure and small occupying area
Product Advantage:
| High precision Placement accuracy: ±10um Rotation accuracy:±0.15° |  |
| Stable motion Compact structure and self-developed gravity balance system make motion stable |  |
| Wafer loading 8 inches wafer standard support |  |
| Nozzle base Nozzle auto-change with 5 nozzles |  |
Main application:
Presintering die bonder is suit able for IGBT, SiC, DTS, resistance and other high temperature
presintering processes. It is mainly used in power module, power supply module, new energy,
smart grid and other industry areas.
Product Parameters:
| Item | Specification |
| Placement accuracy(um) | ±10 |
| Rotation accuracy(@3sigma) | ±0.15° |
| Placement angle deviation | ±1° |
| Placement Z axis force control(g) | 50-10000 |
| Force control accuracy(g) | 50-250g, repeatability ±10g； 250g-8000g, repeatability ±10%； |
| Placement head heating temp | Max. 200℃ |
| Placement head rotation angle | Max. 345° |
| Placement heat cooling | air/nitrogen cooling |
| Chip size(mm) | 0.2*0.2～20*20 |
| Wafer size(inch) | 8 |
| Placement workbench heating temp | Max. 200℃ |
| Placement workbench heating zone temp deviation | ＜5℃ |
| Placement workbench available size(mm) | 380×110 |
| Max. Placement head XYZ axis stroke(mm) | 300x510x70 |
| Equipment repaceable nozzle number | 5 |
| Equipment replacement Pin module number | 5 |
| PCB loading method | Manual |
| Wafer loading Method | Semi-auto(manually place wafer cassette, automatically take wafer) |
| Core motion module | Linear motor+grating scale |
| Machine platform base | Marble platform |
| Machine main body dimension(L×W×H, mm) | 1050X 1065 X 1510 |
| Equipment net weight | Approx.900kg |
Notices:
1,Leakage protection switch: ≥100ma
2,Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3,Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4,Power requirements:
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA
5,The ground is required to withstand a pressure of 800kg/m²
Product Tags:
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Sintering Die Bonder SDB 200 Images
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