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China Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd logo
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
since 1984
Verified Supplier

1 Years

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IC Bonding Machine

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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IC Bonding Machine

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Brand Name : Suneast

Model Number : WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200

Certification : CE、ISO

Place of Origin : Shenzhen, Guangdong Province, China

MOQ : ≥1 pc

Price : Negotiable

Payment Terms : T/T

Delivery Time : 25~50 days

Packaging Details : Plywood crate

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IC Bonding Machine

The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.

IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power device, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.

IC Bonder Machine

IC Bonding Machine IC Bonding Machine IC Bonding Machine

IC Bonding Machine


Product Tags:

combined selective multi module wave solder

      

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